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SÁCH - Chuẩn chấp thuận trong kỹ thuật lắp ráp điện tử phiên bản tiếng Việt (IPC-A-610VN) - Revision D + E + F + G + H + J (Full)
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Trong các nhà máy lắp ráp điện tử hiện nay thường xuyên có các câu hỏi đề cập đến như "cái này có theo IPC không?", "vấn đề này có nêu chuẩn theo IPC không? nếu có thì là bao nhiêu?"
Vào năm 1957 Viện mạch in (Institute of Printed Circuit _ IPC) được thành lập gồm nhiều thành viên là các nhà máy lắp ráp điện tử công nghiệp, sau đó do sự phát triển lượng thành viên tham gia mà IPC đổi tên thành Viện kết nối và đóng gói mạch điện tử (Institute for Interconnecting and Packaging Electronic Circuits), tên này được giữ đến thập niên 1990 mà hầu hết các thành viên trong ngành không thể nhớ đầy đủ tên này cũng như đồng ý về ngữ nghĩa trong cái tên này. Vì thế một lượng lớn thành viên đã buộc phần còn lại giữ lại tên ban đầu là IPC cho bộ đặc tính kỹ thuật trong lắp ráp điện tử công nghiệp.
Một đề xuất khác chỉ ra rằng không thể có một cái tên nào của IPC có thể diễn tả đầy đủ về các OEM, các nhà lắp ráp board mạch, các nhà dịch vụ cho ngành lắp ráp điện tử cũng như các nhà cung ứng.
Để tránh một cái tên vụng về hoặc một cái tên không bao gồm các thành viên mà Viện mạch in (Institute of Printed Circuit _ IPC) sau này là Hiệp hội kết nối điện tử công nghiệp (Association Connecting Electronics Industries) đã đồng ý thống nhất lấy tên IPC là tên chính thức của các bộ đặc tính kỹ thuật cho các ngành sản xuất thiết bị điện tử.
Vậy IPC là:
IPC là tiêu chuẩn/đặc tính kỹ thuật được áp dụng cho ngành công nghiệp lắp ráp điện tử, bộ tiêu chuẩn IPC do Hiệp hội kết nối điện tử công nghiệp (Association Connecting Electronics Industries) ban hành thống nhất cho ngành bao gồm các vấn đề như sau:
(Tạm dịch các mục chính)
General documents (Các bộ tài liệu tổng thể)
IPC-T-50 Terms and Definitions
IPC-2615 Printed Board Dimensions and Tolerances
IPC-D-325 Documentation Requirements for Printed Boards
IPC-A-31 Flexible Raw Material Test Pattern
IPC-ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
Design specifications (Đặc tính kỹ thuật cho thiết kế)
IPC- 2221 Generic Standard on Printed Board Design
IPC-2223 Sectional Design Standard for Flexible Printed Boards
Material specifications (Đặc tính kỹ thuật nguyên vật liệu)
IPC-FC-234 Pressure Sensitive Adhesives Assembly Guidelines for Single-Sided and Double-Sided Flexible Printed Circuits
IPC-4562 Metal Foil for Printed Wiring Applications
IPC-4101 Laminate Prepreg Materials Standard for Printed Boards
IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry
IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Performance and inspection documents (Tài liệu về thực hiện và kiểm tra)
IPC-A-600 Acceptance of Printed Wiring Boards
IPC-A-610 Acceptability of Electronic Assemblies
IPC-6011 Generic Performance Specification for Printed Boards
IPC-6013 Specification for Printed Wiring, Flexible and Rigid-Flex
IPC- 6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
PAS-62123 Performance Guide Manual for Single & Double Sided Flexible Printed Wiring Boards
IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards
Flex assembly and materials standards (Tiêu chuẩn cho nguyên liệu và lắp ráp PCB mềm)
IPC-FA-251 Assembly Guidelines for Single and Double Sided Flexible Printed Circuits
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives
IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films
IPC-A-610J – September 2024
IPC-A-610H – September 2020
IPC-A-610G – October 2017
IPC-A-610F WAM1–
February 2016
IPC-A-610F – July 2014
IPC-A-610E – April 2010
IPC-A-610D – February 2005
IPC-A-610C – January 2000
IPC-A-610B – December 1994
IPC-A-610A – March 1990
IPC-A-610– August 1983
IPC-A-610J
Acceptability of
Electronic Assemblies
Users of this publication are encouraged to participate in the
development of future revisions.
Table of Contents
1.0 General .............................................................................................................. 1-1
1.1 Scope ............................................................................................................ 1-1
1.2 Purpose .......................................................................................................... 1-2
1.3 Classification .................................................................................................... 1-2
1.4 Measurement Units and Applications ........................................................................... 1-2
1.4.1 Verification of Dimensions ...................................................................................... 1-2
1.5 Requirements .................................................................................................... 1-2
1.5.1 Acceptance Criteria ............................................................................................. 1-3
1.5.1.1 Acceptable ....................................................................................................... 1-3
1.5.1.2 Defect ........................................................................................................... 1-3
1.5.1.2.1 Disposition ...................................................................................................... 1-3
1.5.1.3 Process Indicator ................................................................................................ 1-3
1.5.1.4 Conditions Not Specified ........................................................................................ 1-3
1.5.1.5 Specialized Designs ............................................................................................. 1-3
1.5.1.6 Should ........................................................................................................... 1-3
1.6 Process Control Methodologies ................................................................................. 1-3
1.7 Order of Precedence ............................................................................................. 1-4
1.7.1 Clause References ............................................................................................... 1-4
1.7.2 Appendices ...................................................................................................... 1-4
1.8 Terms and Definitions ........................................................................................... 1-4
1.8.1 Board Orientation ............................................................................................... 1-4
1.8.1.1 Primary Side ..................................................................................................... 1-4
1.8.1.2 Secondary Side .................................................................................................. 1-4
1.8.1.3 Solder Source Side .............................................................................................. 1-4
1.8.1.4 Solder Destination Side ......................................................................................... 1-4
1.8.2 Bubble ........................................................................................................... 1-4
1.8.2.1 Bridging Bubble ................................................................................................. 1-4
1.8.3 Cold Solder Connection ......................................................................................... 1-4
1.8.4 Common Conductors ............................................................................................ 1-4
1.8.5 Conductor Overlap .............................................................................................. 1-4
1.8.6 Conductor Overwrap ............................................................................................ 1-4
1.8.7 Diameter ......................................................................................................... 1-5
1.8.8 Electrical Clearance ............................................................................................. 1-5
1.8.9 Engineering Documentation .................................................................................... 1-5
1.8.10 FOD (Foreign Object Debris) ................................................................................... 1-5
1.8.11 Form, Fit, Function (F/F/F) ..................................................................................... 1-5
1.8.12 High Voltage ..................................................................................................... 1-5
1.8.13 Intrusive Solder ................................................................................................. 1-5
1.8.14 Kink ............................................................................................................. 1-5
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1.8.15 Locking Mechanism ............................................................................................. 1-5
1.8.16 Manufacturer .................................................................................................... 1-5
1.8.17 Meniscus (Component) ......................................................................................... 1-5
1.8.18 Noncommon Conductors ........................................................................................ 1-5
1.8.19 Nonfunctional Land ............................................................................................. 1-5
1.8.20 Pin-in-Paste ...................................................................................................... 1-5
1.8.21 Solder Balls ..................................................................................................... 1-5
1.8.22 Standard Industry Practice (SIP) ................................................................................ 1-5
1.8.23 Stress Relief ..................................................................................................... 1-6
1.8.24 Supplier .......................................................................................................... 1-6
1.8.25 Tempered Leads ................................................................................................. 1-6
1.8.26 User .............................................................................................................. 1-6
1.9 Requirements Flowdown ........................................................................................ 1-6
1.10 Personnel Proficiency ........................................................................................... 1-6
1.11 Acceptance Requirements ....................................................................................... 1-6
1.11.1 Missing Parts and Components ................................................................................. 1-6
1.11.2 Jumper Wire or Z-Wire .......................................................................................... 1-6
1.12 Minimum Electrical Clearance (MEC) ......................................................................... 1-7
1.13 Inspection Methodology ........................................................................................ 1-9
1.13.1 Lighting ......................................................................................................... 1-9
1.13.2 Magnification Aids .............................................................................................. 1-9
2.0 Applicable Documents ............................................................................................... 2-1
2.1 IPC Documents .................................................................................................. 2-1
2.2 Joint Industry Documents ....................................................................................... 2-2
2.3 Electrostatic Association Documents ........................................................................... 2-2
2.4 International Electrotechnical Commission Documents ........................................................ 2-2
2.5 ASTM ........................................................................................................... 2-2
2.6 Military Standards ............................................................................................... 2-3
2.7 SAE International ............................................................................................... 2-3
3.0 Handling Electronic Assemblies ..................................................................................... 3-1
4.0 Hardware ............................................................................................................ 4-1
4.1 Hardware Installation ........................................................................................... 4-2
4.1.1 Hardware Installation — Electrical Clearance .................................................................. 4-2
4.1.2 Hardware Installation — Interference ........................................................................... 4-3
4.1.3 Hardware Installation — Component Mounting – High Power ................................................ 4-4
4.1.4 Hardware Installation — Heatsinks ............................................................................. 4-6
4.1.4.1 Hardware Installation — Heatsinks – Insulators and Thermal Compounds .................................... 4-6
4.1.4.2 Hardware Installation — Heatsinks – Contact .................................................................. 4-7
4.1.5 Hardware Installation — Threaded Fasteners and Other Threaded Hardware .................................. 4-8
4.1.5.1 Hardware Installation — Threaded Fasteners and Other Threaded Hardware – Torque ......................4-10
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4.1.5.2 Hardware Installation — Threaded Fasteners and Other Threaded Hardware – Solid Wires .................4-12
4.1.5.3 Hardware Installation — Threaded Fasteners and Other Threaded Hardware – Stranded Wires..............4-14
4.2 Jackpost Mounting .............................................................................................4-15
4.3 Connector Pins .................................................................................................4-16
4.3.1 Connector Pins — Edge Connector Pins .......................................................................4-16
4.3.2 Connector Pins — Press Fit Pins ...............................................................................4-16
4.3.2.1 Connector Pins — Press Fit Pins – Land/Annular Ring .......................................................4-18
4.3.2.2 Connector Pins — Press Fit Pins – Soldering ..................................................................4-19
4.4 Wire Bundle Securing ..........................................................................................4-20
4.5 Routing — Wires and Wire Bundles ...........................................................................4-20
5.0 Soldering ............................................................................................................ 5-1
5.1 Soldering Acceptability Requirements .......................................................................... 5-2
5.2 Soldering Anomalies ............................................................................................ 5-3
5.2.1 Soldering Anomalies — Exposed Basis Metal .................................................................. 5-3
5.2.2 Soldering Anomalies — Pin Holes/Blow Holes/Voids .......................................................... 5-5
5.2.3 Soldering Anomalies — Reflow of Solder Paste ................................................................ 5-6
5.2.4 Soldering Anomalies — Nonwetting ............................................................................ 5-7
5.2.5 Soldering Anomalies — Cold Connection ...................................................................... 5-8
5.2.6 Soldering Anomalies — Dewetting ............................................................................. 5-8
5.2.7 Soldering Anomalies — Excess Solder ......................................................................... 5-9
5.2.7.1 Soldering Anomalies — Excess Solder – Solder Balls ........................................................5-10
5.2.7.2 Soldering Anomalies — Excess Solder – Bridging ............................................................5-11
5.2.7.3 Soldering Anomalies — Excess Solder – Solder Webbing/Splashes ..........................................5-12
5.2.8 Soldering Anomalies — Disturbed Solder .....................................................................5-13
5.2.9 Soldering Anomalies — Cooling Lines and Secondary Reflow ...............................................5-14
5.2.10 Soldering Anomalies — Fractured Solder .....................................................................5-15
5.2.11 Soldering Anomalies — Solder Projections....................................................................5-16
5.2.12 Soldering Anomalies — Pb-Free Fillet Lift ....................................................................5-17
5.2.13 Soldering Anomalies — Pb-Free Hot Tear/Shrink Hole .......................................................5-18
5.2.14 Probe Marks and Other Similar Surface Conditions in Solder Joints ..........................................5-19
5.2.15 Inclusions .......................................................................................................5-20
5.3 Partially Visible or Hidden Solder Connections ...............................................................5-20
5.4 Heat Shrinkable Soldering Devices ............................................................................5-21
6.0 Terminal Connections ................................................................................................ 6-1
6.1 Swaged Hardware ............................................................................................... 6-2
6.1.1 Swaged Hardware — Terminals ................................................................................ 6-2
6.1.1.1 Swaged Hardware — Terminals – Terminal Base to Land Separation ......................................... 6-2
6.1.1.2 Swaged Hardware — Terminals – Turret ....................................................................... 6-4
6.1.1.3 Swaged Hardware — Terminals – Bifurcated .................................................................. 6-5
6.1.2 Swaged Hardware — Rolled Flange ............................................................................ 6-6
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6.1.3 Swaged Hardware — Flared Flange ............................................................................ 6-7
6.1.4 Swaged Hardware — Controlled Split .......................................................................... 6-8
6.1.5 Swaged Hardware — Solder .................................................................................... 6-9
6.2 Insulation .......................................................................................................6-11
6.2.1 Insulation — Damage ..........................................................................................6-11
6.2.1.1 Insulation — Damage – Presolder .............................................................................6-11
6.2.1.2 Insulation — Damage – Post-Solder ...........................................................................6-13
6.2.2 Insulation — Clearance ........................................................................................6-14
6.2.3 Insulation — Insulation Sleeving ..............................................................................6-16
6.2.3.1 Insulation — Insulation Sleeving – Placement ................................................................6-16
6.2.3.2 Insulation — Insulation Sleeving – Damage ...................................................................6-18
6.3 Conductor ......................................................................................................6-19
6.3.1 Conductor — Deformation .....................................................................................6-19
6.3.2 Conductor — Damage .........................................................................................6-20
6.3.2.1 Conductor — Damage – Stranded Wire .......................................................................6-20
6.3.2.2 Conductor — Damage – Solid Wire ...........................................................................6-21
6.3.3 Conductor — Strand Separation (Birdcaging) – Presolder ....................................................6-21
6.3.4 Conductor — Strand Separation (Birdcaging) – Post-Solder ..................................................6-22
6.3.5 Conductor — Tinning ..........................................................................................6-23
6.4 Service Loops ..................................................................................................6-25
6.5 Routing — Wires and Wire Bundles – Bend Radius ...........................................................6-26
6.6 Stress Relief ....................................................................................................6-27
6.6.1 Stress Relief — Wire ...........................................................................................6-27
6.7 Lead/Conductor Placement — General Requirements .........................................................6-29
6.8 Solder — General Requirements ..............................................................................6-30
6.9 Turrets and Straight Pins .......................................................................................6-32
6.9.1 Turrets and Straight Pins — Conductor Placement ............................................................6-32
6.9.2 Turrets and Straight Pins — Solder ............................................................................6-34
6.10 Bifurcated ......................................................................................................6-35
6.10.1 Bifurcated — Conductor Placement – Side Route Attachments ...............................................6-35
6.10.2 Bifurcated — Conductor Placement – Staked Wires...........................................................6-37
6.10.3 Bifurcated — Conductor Placement – Bottom and Top Route Attachments ..................................6-38
6.10.4 Bifurcated — Solder ...........................................................................................6-39
6.11 Slotted ..........................................................................................................6-41
6.11.1 Slotted — Conductor Placement ...............................................................................6-41
6.11.2 Slotted — Solder ...............................................................................................6-42
6.12 Pierced/Perforated ..............................................................................................6-43
6.12.1 Pierced/Perforated — Conductor Placement ...................................................................6-43
6.12.2 Pierced/Perforated — Solder ...................................................................................6-45
6.13 Hook ............................................................................................................6-46
6.13.1 Hook — Conductor Placement .................................................................................6-46
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6.13.2 Hook — Solder .................................................................................................6-48
6.14 Solder Cups ....................................................................................................6-49
6.14.1 Solder Cups — Conductor Placement .........................................................................6-49
6.14.2 Solder Cups — Solder..........................................................................................6-50
6.15 AWG 30 and Smaller Diameter Wires — Conductor Placement ..............................................6-52
6.16 Series Connected ...............................................................................................6-54
6.17 Edge Clip — Position ..........................................................................................6-55
7.0 Through-Hole Technology ........................................................................................... 7-1
7.1 Component Mounting ........................................................................................... 7-1
7.1.1 Component Mounting — Orientation ........................................................................... 7-1
7.1.1.1 Component Mounting — Orientation – Horizontal ............................................................. 7-2
7.1.1.2 Component Mounting — Orientation – Vertical ................................................................ 7-3
7.1.2 Component Mounting — Lead Forming ........................................................................ 7-4
7.1.2.1 Component Mounting — Lead Forming – Bend Radius ....................................................... 7-4
7.1.2.2 Component Mounting — Lead Forming – Space between Seal/Weld and Bend ............................... 7-5
7.1.2.3 Component Mounting — Lead Forming – Stress Relief ........................................................ 7-6
7.1.2.4 Component Mounting — Lead Forming – Damage ............................................................ 7-8
7.1.3 Component Mounting — Leads Crossing Conductors ......................................................... 7-9
7.1.4 Component Mounting — Hole Obstruction....................................................................7-10
7.1.5 Component Mounting — DIP/SIP Devices and Sockets ......................................................7-11
7.1.6 Component Mounting — Radial Leads – Vertical .............................................................7-13
7.1.6.1 Component Mounting — Radial Leads – Vertical – Spacers ..................................................7-14
7.1.7 Component Mounting — Radial Leads – Horizontal ..........................................................7-15
7.1.8 Component Mounting — Connectors ..........................................................................7-16
7.1.8.1 Component Mounting — Connectors – Right Angle ..........................................................7-17
7.1.8.2 Component Mounting — Connectors – Vertical Shrouded Pin Headers and Vertical Receptacle
Connectors .....................................................................................................7-18
7.2 Component Securing ...........................................................................................7-19
7.2.1 Component Securing — Mounting Clips ......................................................................7-19
7.2.2 Component Securing — Adhesive Bonding ...................................................................7-20
7.2.2.1 Component Securing — Adhesive Bonding – Nonelevated Components .....................................7-21
7.2.2.2 Component Securing — Adhesive Bonding – Elevated Components .........................................7-24
7.2.3 Component Securing — Other Devices ........................................................................7-27
7.3 Supported Holes ................................................................................................7-28
7.3.1 Supported Holes — Axial Loaded – Horizontal ...............................................................7-28
7.3.2 Supported Holes — Axial Loaded – Vertical ..................................................................7-29
7.3.3 Supported Holes — Leads/Conductors Protrusion .............................................................7-31
7.3.4 Supported Holes — Lead/Conductor Clinches ................................................................7-32
7.3.5 Supported Holes — Solder .....................................................................................7-33
7.3.5.1 Supported Holes — Solder – Vertical Fill (A) .................................................................7-36
7.3.5.2 Supported Holes — Solder – Solder Destination Side – Lead to Barrel (B) ..................................7-38
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7.3.5.3 Supported Holes — Solder – Solder Destination Side – Land Area Coverage (C) ............................7-40
7.3.5.4 Supported Holes — Solder – Solder Source Side – Lead to Barrel (D) .......................................7-41
7.3.5.5 Supported Holes — Solder – Solder Source Side – Land Area Coverage (E) .................................7-42
7.3.5.6 Supported Holes — Solder Conditions – Solder in Lead Bend ................................................7-43
7.3.5.7 Supported Holes — Solder Conditions – Touching Through-Hole Component Body ........................7-44
7.3.5.8 Supported Holes — Solder Conditions – Meniscus in Solder .................................................7-45
7.3.5.9 Supported Holes — Lead Cutting After Soldering .............................................................7-47
7.3.5.10 Supported Holes — Coated Wire Insulation in Solder .........................................................7-48
7.3.5.11 Supported Holes — Interfacial Connection without Lead – Vias ..............................................7-49
7.3.5.12 Supported Holes — Board in Board ...........................................................................7-50
7.4 Unsupported Holes .............................................................................................7-53
7.4.1 Unsupported Holes — Axial Leads – Horizontal ..............................................................7-53
7.4.2 Unsupported Holes — Axial Leads – Vertical .................................................................7-54
7.4.3 Unsupported Holes — Wire/Lead Protrusion ..................................................................7-55
7.4.4 Unsupported Holes — Wire/Lead Clinches ....................................................................7-56
7.4.5 Unsupported Holes — Solder ..................................................................................7-58
7.4.6 Unsupported Holes — Lead Cutting After Soldering ..........................................................7-60
8.0 Surface Mount Assemblies .......................................................................................... 8-1
8.1 Staking Adhesive ................................................................................................ 8-2
8.1.1 Staking Adhesive — Component Bonding ...................................................................... 8-2
8.1.2 Staking Adhesive — Mechanical Strength ...................................................................... 8-3
8.2 SMT Leads ...................................................................................................... 8-5
8.2.1 SMT Leads — Plastic Components ............................................................................. 8-5
8.2.2 SMT Leads — Damage ......................................................................................... 8-5
8.2.3 SMT Leads — Flattening ....................................................................................... 8-6
8.3 SMT Connections ............................................................................................... 8-6
8.3.1 Chip Components — Bottom Only Terminations ............................................................... 8-7
8.3.1.1 Chip Components — Bottom Only Terminations – Side Overhang (A) ........................................ 8-8
8.3.1.2 Chip Components — Bottom Only Terminations – End Overhang (B) ........................................ 8-9
8.3.1.3 Chip Components — Bottom Only Terminations – End Joint Width (C) .....................................8-10
8.3.1.4 Chip Components — Bottom Only Terminations – Side Joint Length (D) ....................................8-11
8.3.1.5 Chip Components — Bottom Only Terminations – Maximum Fillet Height (E) ..............................8-12
8.3.1.6 Chip Components — Bottom Only Terminations – Minimum Fillet Height (F) ..............................8-12
8.3.1.7 Chip Components — Bottom Only Terminations – Solder Thickness (G) ....................................8-13
8.3.1.8 Chip Components — Bottom Only Terminations – End Overlap (J) ..........................................8-13
8.3.2 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) ...........................8-14
8.3.2.1 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Side Overhang (A) .............................................................................................8-15
8.3.2.2 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
End Overhang (B) ..............................................................................................8-17
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8.3.2.3 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
End Joint Width (C) ............................................................................................8-18
8.3.2.4 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Side Joint Length (D) ..........................................................................................8-20
8.3.2.5 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Maximum Fillet Height (E) ....................................................................................8-21
8.3.2.6 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Minimum Fillet Height (F) .....................................................................................8-22
8.3.2.7 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Solder Thickness (G) ...........................................................................................8-23
8.3.2.8 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
End Overlap (J) .................................................................................................8-24
8.3.2.9 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Termination Variations .........................................................................................8-25
8.3.2.9.1 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Termination Variations – Mounting on Side (Billboarding) ...................................................8-25
8.3.2.9.2 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Termination Variations – Mounting Upside Down .............................................................8-27
8.3.2.9.3 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Termination Variations – Stacking .............................................................................8-28
8.3.2.9.4 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Termination Variations – Tombstoning.........................................................................8-29
8.3.2.10 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Center and Lateral Terminations ...............................................................................8-30
8.3.2.10.1 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Center and Lateral Terminations – Solder Width of Side Termination ........................................8-31
8.3.2.10.2 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Center and Lateral Terminations – Minimum Fillet Height of Side Termination ..............................8-32
8.3.3 Cylindrical End Cap Terminations .............................................................................8-33
8.3.3.1 Cylindrical End Cap Terminations — Side Overhang (A) .....................................................8-34
8.3.3.2 Cylindrical End Cap Terminations — End Overhang (B) .....................................................8-35
8.3.3.3 Cylindrical End Cap Terminations — End Joint Width (C) ...................................................8-36
8.3.3.4 Cylindrical End Cap Terminations — Side Joint Length (D) ..................................................8-37
8.3.3.5 Cylindrical End Cap Terminations — Maximum Fillet Height (E) ............................................8-38
8.3.3.6 Cylindrical End Cap Terminations — Minimum Fillet Height (F) ............................................8-39
8.3.3.7 Cylindrical End Cap Terminations — Solder Thickness (G) ..................................................8-40
8.3.3.8 Cylindrical End Cap Terminations — End Overlap (J) ........................................................8-41
8.3.3.9 Cylindrical End Cap Terminations — Center and Lateral Terminations .......................................8-42
8.3.4 Castellated Terminations .......................................................................................8-43
8.3.4.1 Castellated Terminations — Side Overhang (A) ...............................................................8-44
8.3.4.2 Castellated Terminations — End Overhang (B) ...............................................................8-45
8.3.4.3 Castellated Terminations — Minimum End Joint Width (C) ..................................................8-45
8.3.4.4 Castellated Terminations — Minimum Side Joint Length (D) .................................................8-46
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8.3.4.5 Castellated Terminations — Maximum Fillet Height (E) ......................................................8-46
8.3.4.6 Castellated Terminations — Minimum Fillet Height (F) ......................................................8-47
8.3.4.7 Castellated Terminations — Solder Thickness (G) ............................................................8-47
8.3.5 Flat Gull Wing Leads ...........................................................................................8-48
8.3.5.1 Flat Gull Wing Leads — Side Overhang (A) ..................................................................8-49
8.3.5.2 Flat Gull Wing Leads — Toe Overhang (B) ...................................................................8-52
8.3.5.3 Flat Gull Wing Leads — Minimum End Joint Width (C) ......................................................8-53
8.3.5.4 Flat Gull Wing Leads — Minimum Side Joint Length (D) ....................................................8-54
8.3.5.5 Flat Gull Wing Leads — Maximum Heel Fillet Height (E) ...................................................8-55
8.3.5.6 Flat Gull Wing Leads — Minimum Heel Fillet Height (F) ....................................................8-56
8.3.5.7 Flat Gull Wing Leads — Solder Thickness (G) ................................................................8-57
8.3.5.8 Flat Gull Wing Leads — Coplanarity ..........................................................................8-58
8.3.6 Round or Flattened (Coined) Gull Wing Leads ................................................................8-59
8.3.6.1 Round or Flattened (Coined) Gull Wing Leads — Side Overhang (A) ........................................8-60
8.3.6.2 Round or Flattened (Coined) Gull Wing Leads — Toe Overhang (B) .........................................8-61
8.3.6.3 Round or Flattened (Coined) Gull Wing Leads — Minimum End Joint Width (C) ...........................8-61
8.3.6.4 Round or Flattened (Coined) Gull Wing Leads — Minimum Side Joint Length (D) .........................8-62
8.3.6.5 Round or Flattened (Coined) Gull Wing Leads — Maximum Heel Fillet Height (E) .........................8-63
8.3.6.6 Round or Flattened (Coined) Gull Wing Leads — Minimum Heel Fillet Height (F) .........................8-64
8.3.6.7 Round or Flattened (Coined) Gull Wing Leads — Solder Thickness (G) .....................................8-65
8.3.6.8 Round or Flattened (Coined) Gull Wing Leads — Minimum Side Joint Height (Q) ..........................8-65
8.3.6.9 Round or Flattened (Coined) Gull Wing Leads — Coplanarity ...............................................8-66
8.3.7 J Leads..........................................................................................................8-67
8.3.7.1 J Leads — Side Overhang (A) .................................................................................8-67
8.3.7.2 J Leads — Toe Overhang (B) ..................................................................................8-69
8.3.7.3 J Leads — End Joint Width (C) ................................................................................8-70
8.3.7.4 J Leads — Side Joint Length (D) ..............................................................................8-71
8.3.7.5 J Leads — Maximum Heel Fillet Height (E) ..................................................................8-72
8.3.7.6 J Leads — Minimum Heel Fillet Height (F) ...................................................................8-73
8.3.7.7 J Leads — Solder Thickness (G) ...............................................................................8-75
8.3.7.8 J Leads — Coplanarity .........................................................................................8-75
8.3.8 Butt/I Connections .............................................................................................8-76
8.3.8.1 Butt/I Connections — Modified Through-Hole Terminations .................................................8-76
8.3.8.1.1 Butt/I Connections — Modified Through-Hole Terminations – Maximum Side Overhang (A) ..............8-77
8.3.8.1.2 Butt/I Connections — Modified Through-Hole Terminations – Toe Overhang (B) ...........................8-77
8.3.8.1.3 Butt/I Connections — Modified Through-Hole Terminations – Minimum End Joint Width (C)..............8-78
8.3.8.1.4 Butt/I Connections — Modified Through-Hole Terminations – Minimum Side Joint Length (D) ............8-78
8.3.8.1.5 Butt/I Connections — Modified Through-Hole Terminations – Maximum Fillet Height (E) .................8-78
8.3.8.1.6 Butt/I Connections — Modified Through-Hole Terminations – Minimum Fillet Height (F) ..................8-79
8.3.8.1.7 Butt/I Connections — Modified Through-Hole Terminations – Solder Thickness (G) ........................8-79
8.3.8.2 Butt/I Connections — Solder Charged Terminations ..........................................................8-80
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8.3.8.2.1 Butt/I Connections — Solder Charged Terminations – Maximum Side Overhang (A) .......................8-81
8.3.8.2.2 Butt/I Connections — Solder Charged Terminations – Maximum Toe Overhang (B) ........................8-81
8.3.8.2.3 Butt/I Connections — Solder Charged Terminations – Minimum End Joint Width (C) .......................8-82
8.3.8.2.4 Butt/I Connections — Solder Charged Terminations – Minimum Fillet Height (F) ...........................8-82
8.3.9 Flat Lug Leads .................................................................................................8-83
8.3.10 Tall Profile Components Having Bottom Only Terminations ..................................................8-84
8.3.11 Inward Formed L-Shaped Ribbon Leads ......................................................................8-85
8.3.12 Surface Mount Area Array .....................................................................................8-87
8.3.12.1 Surface Mount Area Array — Alignment ......................................................................8-88
8.3.12.2 Surface Mount Area Array — Solder Ball Spacing ............................................................8-88
8.3.12.3 Surface Mount Area Array — Solder Connections ............................................................8-89
8.3.12.4 Surface Mount Area Array — Voids ...........................................................................8-91
8.3.12.5 Surface Mount Area Array — Underfill/Staking ...............................................................8-91
8.3.12.6 Surface Mount Area Array — Package on Package ...........................................................8-92
8.3.13 Bottom Termination Components (BTC) ......................................................................8-94
8.3.14 Components with Bottom Thermal Pad Terminations (D-Pak) ................................................8-96
8.3.15 Flattened Post Connections ....................................................................................8-98
8.3.15.1 Flattened Post Connections — Maximum Termination Overhang – Square Solder Land .....................8-98
8.3.15.2 Flattened Post Connections — Maximum Termination Overhang – Round Solder Land .....................8-99
8.3.15.3 Flattened Post Connections — Maximum Fillet Height .......................................................8-99
8.3.16 P-Style Terminations ..........................................................................................8-100
8.3.16.1 P-Style Terminations — Maximum Side Overhang (A) ......................................................8-101
8.3.16.2 P-Style Terminations — Maximum Toe Overhang (B) .......................................................8-101
8.3.16.3 P-Style Terminations — Minimum End Joint Width (C) .....................................................8-102
8.3.16.4 P-Style Terminations — Minimum Side Joint Length (D) ....................................................8-102
8.3.16.5 P-Style Terminations — Minimum Fillet Height (F) .........................................................8-103
8.3.17 Vertical Cylindrical Cans with Outward L-Shaped Lead Terminations .......................................8-104
8.3.18 Flexible and Rigid Flex Printed Circuitry with Flat Uniformed Leads .......................................8-106
8.3.19 Wrapped Terminals ............................................................................................8-107
8.3.19.1 Wrapped Terminals — Side Overhang (A) ...................................................................8-108
8.3.19.2 Wrapped Terminals — End Joint Width (C) ..................................................................8-108
8.3.19.3 Wrapped Terminals — Side Joint Length (D).................................................................8-108
8.3.19.4 Wrapped Terminals — Minimum Heel Fillet Height (F) .....................................................8-109
8.3.19.5 Wrapped Terminals — Solder Thickness (G) .................................................................8-109
8.3.20 Flat Leaded Surface Mount Connectors .......................................................................8-110
8.4 Specialized SMT Terminations ................................................................................8-111
8.5 Surface Mount Connectors ....................................................................................8-112
8.5.1 Surface Mount Connectors — Surface Mount Threaded Standoffs (SMTS) or Surface Mount Fasteners ...8-113
9.0 Component Damage ................................................................................................. 9-1
9.1 Loss of Metallization ............................................................................................ 9-2
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9.2 Chip Resistor Element .......................................................................................... 9-3
9.3 Leaded/Leadless Devices ....................................................................................... 9-4
9.4 Ceramic Chip Capacitors ........................................................................................ 9-8
9.5 Connectors .....................................................................................................9-10
9.6 Relays ..........................................................................................................9-13
9.7 Ferrite Core Components ......................................................................................9-13
9.8 Connectors, Handles, Extractors, Latches .....................................................................9-14
9.9 Edge Connector Pins ...........................................................................................9-15
9.10 Press Fit Pins ...................................................................................................9-16
9.11 Backplane Connector Pins .....................................................................................9-17
9.12 Heatsink Hardware .............................................................................................9-18
9.13 Threaded Items and Hardware .................................................................................9-19
10.0 Printed Boards and Assemblies .....................................................................................10-1
10.1 Non-Soldered Contact Areas ...................................................................................10-1
10.1.1 Non-Soldered Contact Area — Contamination ................................................................10-1
10.1.2 Non-Soldered Contact Area — Damage .......................................................................10-3
10.2 Laminate Conditions ...........................................................................................10-3
10.2.1 Laminate Conditions — Measling and Crazing ................................................................10-5
10.2.2 Laminate Conditions — Blistering and Delamination .........................................................10-7
10.2.3 Laminate Conditions — Weave Texture/Weave Exposure ....................................................10-10
10.2.4 Laminate Conditions — Haloing ..............................................................................10-11
10.2.5 Laminate Conditions — Nicks and Cracks ...................................................................10-13
10.2.6 Laminate Conditions — Burns ................................................................................10-15
10.2.7 Laminate Conditions — Bow and Twist ......................................................................10-16
10.2.8 Laminate Conditions — Depanelization ......................................................................10-17
10.2.9 Laminate Conditions — Mechanical Damage ................................................................10-19
10.3 Conductors/Lands .............................................................................................10-20
10.3.1 Conductors/Lands — Reduction ..............................................................................10-20
10.3.2 Conductors/Lands — Lifted...................................................................................10-21
10.3.3 Conductors/Lands — Mechanical Damage ...................................................................10-23
10.4 Flexible and Rigid-Flex Printed Boards.......................................................................10-24
10.4.1 Flexible and Rigid-Flex Printed Boards — Damage ..........................................................10-24
10.4.2 Flexible and Rigid-Flex Printed Boards — Delamination/Blister ............................................10-27
10.4.2.1 Flexible and Rigid-Flex Printed Boards — Delamination/Blister – Flex .....................................10-27
10.4.2.2 Flexible and Rigid-Flex Printed Boards — Delamination/Blister – Flex to Stiffener ........................10-29
10.4.3 Flexible and Rigid-Flex Printed Boards — Solder Wicking ..................................................10-30
10.4.4 Flexible and Rigid-Flex Printed Boards — Attachment ......................................................10-31
10.5 Marking .......................................................................................................10-32
10.5.1 Marking — Etched (Including Hand Printing) ................................................................10-34
10.5.2 Marking — Screened ..........................................................................................10-35
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10.5.3 Marking — Stamped ..........................................................................................10-36
10.5.4 Marking — Laser .............................................................................................10-37
10.5.5 Marking — Labels ............................................................................................10-37
10.5.5.1 Marking — Labels – Bar Coding/Data Matrix ................................................................10-37
10.5.5.2 Marking — Labels – Readability .............................................................................10-38
10.5.5.3 Marking — Labels – Adhesion and Damage .................................................................10-39
10.5.5.4 Marking — Labels – Position .................................................................................10-39
10.5.6 Marking — Radio Frequency Identification (RFID) Tags ....................................................10-40
10.6 Cleanliness ....................................................................................................10-41
10.6.1 Cleanliness — Flux Residues .................................................................................10-42
10.6.1.1 Cleanliness — Flux Residues – Cleaning Required ..........................................................10-42
10.6.1.2 Cleanliness — Flux Residues – No Clean Process ...........................................................10-43
10.6.2 Cleanliness — Foreign Object Debris (FOD) .................................................................10-44
10.6.3 Cleanliness — Chlorides, Carbonates and White Residues ...................................................10-45
10.6.4 Cleanliness — Surface Appearance ...........................................................................10-47
10.7 Solder Mask Coating ..........................................................................................10-48
10.7.1 Solder Mask Coating — Wrinkling/Cracking .................................................................10-49
10.7.2 Solder Mask Coating — Voids, Blisters, Scratches ...........................................................10-51
10.7.3 Solder Mask Coating — Breakdown ..........................................................................10-53
10.7.4 Solder Mask Coating — Discoloration .......................................................................10-54
10.8 Conformal Coating ............................................................................................10-54
10.8.1 Conformal Coating — General ...............................................................................10-54
10.8.2 Conformal Coating — Coverage ..............................................................................10-55
10.8.3 Conformal Coating — Thickness .............................................................................10-57
10.9 Electrical Insulation Coating ..................................................................................10-58
10.9.1 Electrical Insulation Coating — Coverage ....................................................................10-58
10.9.2 Electrical Insulation Coating — Thickness ...................................................................10-58
10.10 Encapsulation .................................................................................................10-59
11.0 Discrete Wiring .....................................................................................................11-1
11.1 Solderless Wrap ................................................................................................11-1
12.0 High Voltage ........................................................................................................12-1
13.0 Jumper Wires .......................................................................................................13-1
13.1 Wire Routing ...................................................................................................13-2
13.2 Wire Staking — Adhesive or Tape .............................................................................13-3
13.3 Terminations ....................................................................................................13-4
13.3.1 Terminations — Lap ...........................................................................................13-5
13.3.1.1 Terminations — Lap – Component Lead ......................................................................13-5
13.3.1.2 Terminations — Lap – Land ...................................................................................13-7
13.3.2 Terminations — Wire in Hole ..................................................................................13-8
13.3.3 Terminations — Wrapped ......................................................................................13-9
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13.3.4 Terminations — SMT .........................................................................................13-10
13.3.4.1 Terminations — SMT – Chip and Cylindrical End Cap Components ........................................13-10
13.3.4.2 Terminations — SMT – Gull Wing ...........................................................................13-11
13.3.4.3 Terminations — SMT – Castellations .........................................................................13-13
Tables
Table 1-1 Summary of Related Documents ................................................................................ 1-1
Table 1-2 Inspection Magnification (Land Width) ......................................................................... 1-9
Table 1-3 Magnification Aid Applications For Wires And Soldered Conductors ........................................1-10
Table 1-4 Magnification Aid Applications – Other .......................................................................1-10
Table 6-1 Swaged Hardware Minimum Soldering Requirements ......................................................... 6-9
Table 6-2 Strand Damage .................................................................................................6-20
Table 6-3 Minimum Bend Radius Requirements .........................................................................6-26
Table 6-4 Turret or Straight Pin Terminal Conductor Placement .........................................................6-32
Table 6-5 Bifurcated Terminal Conductor Placement – Side Route ......................................................6-35
Table 6-6 Staking Requirements of Side Route Straight Through Connections – Bifurcated Terminals .................6-37
Table 6-7 Bifurcated Terminal Conductor Placement – Bottom Route ...................................................6-38
Table 6-8 Pierced or Perforated Terminal Conductor Placement .........................................................6-43
Table 6-9 Hook Terminal Conductor Placement ..........................................................................6-46
Table 6-10 AWG 30 and Smaller Wire Wrap Requirements ...............................................................6-52
Table 7-1 Lead Bend Radius ............................................................................................... 7-4
Table 7-2 Component to Land Clearance .................................................................................7-29
Table 7-3 Protrusion of Leads/Conductors in Supported Holes ..........................................................7-31
Table 7-4 Supported Hole – Minimum Solder Requirements ............................................................7-35
Table 7-5 Board in Board – Minimum Acceptable Solder Conditions ...................................................7-50
Table 7-6 Protrusion of Leads in Unsupported Holes ....................................................................7-55
Table 7-7 Unsupported Holes with Component Leads, Minimum Acceptable Conditions ..............................7-58
Table 8-1 Dimensional Criteria – Chip Component – Bottom Only Termination Features ............................... 8-7
Table 8-2 Dimensional Criteria – Rectangular or Square End Chip Components – 1, 2, 3 or 5 Side Termination(s) ....8-14
Table 8-2A Dimensional Criteria – Center/Lateral Termination (When Present) – Rectangular or Square End Chip
Components – 1, 2, 3 or 5 Side Termination(s) ................................................................8-30
Table 8-3 Dimensional Criteria – Cylindrical End Cap Termination .....................................................8-33
Table 8-3A Dimensional Criteria – Cylindrical End Cap Terminations – Center and Lateral Terminations ...............8-42
Table 8-4 Dimensional Criteria – Castellated Terminations ..............................................................8-43
Table 8-5 Dimensional Criteria – Flat Gull Wing Leads .................................................................8-48
Table 8-6 Dimensional Criteria – Round or Flattened (Coined) Gull Wing Lead Features ..............................8-59
Table 8-7 Dimensional Criteria – J Leads ................................................................................8-67
Table 8-8 Dimensional Criteria – Butt/I Connections – Modified Through-Hole Leads .................................8-76
Table 8-9 Dimensional Criteria – Butt/I Connections – Solder Charged Terminations ..................................8-80
Table 8-10 Dimensional Criteria – Flat Lug Leads ........................................................................8-83
Table 8-11 Dimensional Criteria – Tall Profile Components Having Bottom Only Terminations .........................8-84
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Table 8-12 Dimensional Criteria – Inward Formed L-Shaped Ribbon Leads .............................................8-85
Table 8-13 Dimensional Criteria – Ball Grid Array Components with Collapsing Balls ..................................8-87
Table 8-14 Ball Grid Array Components with Noncollapsing Balls .......................................................8-87
Table 8-15 Column Grid Array .............................................................................................8-87
Table 8-16 Dimensional Criteria – BTC ...................................................................................8-94
Table 8-17 Dimensional Criteria – Bottom Thermal Pad Terminations (D-Pak) ..........................................8-96
Table 8-18 Dimensional Criteria Flattened Post Connections .............................................................8-98
Table 8-19 Dimensional Criteria – P-Style Terminations .................................................................8-100
Table 8-20 Dimensional Criteria – Vertical Cylindrical Cans with Outward L-Shaped Lead Terminations .............8-105
Table 8-21 Dimensional Criteria – Flexible and Rigid-Flex Circuitry with Flat Unformed Leads .......................8-106
Table 8-22 Dimensional Criteria – Wrapped Terminals ...................................................................8-107
Table 8-23 Dimensional Criteria – Flat Leaded Surface Mount Connectors .............................................8-110
Table 8-24 SMTS/Surface Mount Fasteners – Minimum Acceptable Solder Conditions ................................8-113
Table 9-1 Nick or Chip-Out Criteria ....................................................................................... 9-8
Table 10-1 Coating Thickness Requirements .............................................................................10-57
Table A-1 Typical Static Charge Sources ..................................................................................A-3
Table A-2 Typical Static Voltage Generation ...............................................................................A-3
Table A-3 Recommended Practices for Handling Electronic Assemblies..................................................A-6
Appendix A Protecting the Assembly — ESD and Other Handling Considerations ..........................................A-1
A.1 ESD Prevention .................................................................................................A-1
A.1.1 ESD Control Program ...........................................................................................A-1
A.1.2 ESD Protective Area (EPA) Requirements ......................................................................A-2
A.1.3 Minimizing Static Charge .......................................................................................A-3
A.1.4 ESD Protective Packaging ......................................................................................A-4
A.1.5 Training..........................................................................................................A-4
A.1.6 Tools And Equipment ...........................................................................................A-4
A.1.7 Compliance Verification .........................................................................................A-5
A.1.8 ESD Prevention – Warning Labels ..............................................................................A-5
A.2 General Handling ................................................................................................A-6
A.2.1 Handling Considerations ........................................................................................A-6
A.2.2 Preventing Contamination.......................................................................................A-7
A.2.3 Handling Considerations – Gloves and Finger Cots ............................................................A-7
A.3 Moisture Sensitive Devices .....................................................................................A8
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Trong các nhà máy lắp ráp điện tử hiện nay thường xuyên có các câu hỏi đề cập đến như "cái này có theo IPC không?", "vấn đề này có nêu chuẩn theo IPC không? nếu có thì là bao nhiêu?"
Vào năm 1957 Viện mạch in (Institute of Printed Circuit _ IPC) được thành lập gồm nhiều thành viên là các nhà máy lắp ráp điện tử công nghiệp, sau đó do sự phát triển lượng thành viên tham gia mà IPC đổi tên thành Viện kết nối và đóng gói mạch điện tử (Institute for Interconnecting and Packaging Electronic Circuits), tên này được giữ đến thập niên 1990 mà hầu hết các thành viên trong ngành không thể nhớ đầy đủ tên này cũng như đồng ý về ngữ nghĩa trong cái tên này. Vì thế một lượng lớn thành viên đã buộc phần còn lại giữ lại tên ban đầu là IPC cho bộ đặc tính kỹ thuật trong lắp ráp điện tử công nghiệp.
Một đề xuất khác chỉ ra rằng không thể có một cái tên nào của IPC có thể diễn tả đầy đủ về các OEM, các nhà lắp ráp board mạch, các nhà dịch vụ cho ngành lắp ráp điện tử cũng như các nhà cung ứng.
Để tránh một cái tên vụng về hoặc một cái tên không bao gồm các thành viên mà Viện mạch in (Institute of Printed Circuit _ IPC) sau này là Hiệp hội kết nối điện tử công nghiệp (Association Connecting Electronics Industries) đã đồng ý thống nhất lấy tên IPC là tên chính thức của các bộ đặc tính kỹ thuật cho các ngành sản xuất thiết bị điện tử.
Vậy IPC là:
IPC là tiêu chuẩn/đặc tính kỹ thuật được áp dụng cho ngành công nghiệp lắp ráp điện tử, bộ tiêu chuẩn IPC do Hiệp hội kết nối điện tử công nghiệp (Association Connecting Electronics Industries) ban hành thống nhất cho ngành bao gồm các vấn đề như sau:
(Tạm dịch các mục chính)
General documents (Các bộ tài liệu tổng thể)
IPC-T-50 Terms and Definitions
IPC-2615 Printed Board Dimensions and Tolerances
IPC-D-325 Documentation Requirements for Printed Boards
IPC-A-31 Flexible Raw Material Test Pattern
IPC-ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
Design specifications (Đặc tính kỹ thuật cho thiết kế)
IPC- 2221 Generic Standard on Printed Board Design
IPC-2223 Sectional Design Standard for Flexible Printed Boards
Material specifications (Đặc tính kỹ thuật nguyên vật liệu)
IPC-FC-234 Pressure Sensitive Adhesives Assembly Guidelines for Single-Sided and Double-Sided Flexible Printed Circuits
IPC-4562 Metal Foil for Printed Wiring Applications
IPC-4101 Laminate Prepreg Materials Standard for Printed Boards
IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry
IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Performance and inspection documents (Tài liệu về thực hiện và kiểm tra)
IPC-A-600 Acceptance of Printed Wiring Boards
IPC-A-610 Acceptability of Electronic Assemblies
IPC-6011 Generic Performance Specification for Printed Boards
IPC-6013 Specification for Printed Wiring, Flexible and Rigid-Flex
IPC- 6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
PAS-62123 Performance Guide Manual for Single & Double Sided Flexible Printed Wiring Boards
IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards
Flex assembly and materials standards (Tiêu chuẩn cho nguyên liệu và lắp ráp PCB mềm)
IPC-FA-251 Assembly Guidelines for Single and Double Sided Flexible Printed Circuits
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives
IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films
IPC-A-610J – September 2024
IPC-A-610H – September 2020
IPC-A-610G – October 2017
IPC-A-610F WAM1–
February 2016
IPC-A-610F – July 2014
IPC-A-610E – April 2010
IPC-A-610D – February 2005
IPC-A-610C – January 2000
IPC-A-610B – December 1994
IPC-A-610A – March 1990
IPC-A-610– August 1983
IPC-A-610J
Acceptability of
Electronic Assemblies
Users of this publication are encouraged to participate in the
development of future revisions.
Table of Contents
1.0 General .............................................................................................................. 1-1
1.1 Scope ............................................................................................................ 1-1
1.2 Purpose .......................................................................................................... 1-2
1.3 Classification .................................................................................................... 1-2
1.4 Measurement Units and Applications ........................................................................... 1-2
1.4.1 Verification of Dimensions ...................................................................................... 1-2
1.5 Requirements .................................................................................................... 1-2
1.5.1 Acceptance Criteria ............................................................................................. 1-3
1.5.1.1 Acceptable ....................................................................................................... 1-3
1.5.1.2 Defect ........................................................................................................... 1-3
1.5.1.2.1 Disposition ...................................................................................................... 1-3
1.5.1.3 Process Indicator ................................................................................................ 1-3
1.5.1.4 Conditions Not Specified ........................................................................................ 1-3
1.5.1.5 Specialized Designs ............................................................................................. 1-3
1.5.1.6 Should ........................................................................................................... 1-3
1.6 Process Control Methodologies ................................................................................. 1-3
1.7 Order of Precedence ............................................................................................. 1-4
1.7.1 Clause References ............................................................................................... 1-4
1.7.2 Appendices ...................................................................................................... 1-4
1.8 Terms and Definitions ........................................................................................... 1-4
1.8.1 Board Orientation ............................................................................................... 1-4
1.8.1.1 Primary Side ..................................................................................................... 1-4
1.8.1.2 Secondary Side .................................................................................................. 1-4
1.8.1.3 Solder Source Side .............................................................................................. 1-4
1.8.1.4 Solder Destination Side ......................................................................................... 1-4
1.8.2 Bubble ........................................................................................................... 1-4
1.8.2.1 Bridging Bubble ................................................................................................. 1-4
1.8.3 Cold Solder Connection ......................................................................................... 1-4
1.8.4 Common Conductors ............................................................................................ 1-4
1.8.5 Conductor Overlap .............................................................................................. 1-4
1.8.6 Conductor Overwrap ............................................................................................ 1-4
1.8.7 Diameter ......................................................................................................... 1-5
1.8.8 Electrical Clearance ............................................................................................. 1-5
1.8.9 Engineering Documentation .................................................................................... 1-5
1.8.10 FOD (Foreign Object Debris) ................................................................................... 1-5
1.8.11 Form, Fit, Function (F/F/F) ..................................................................................... 1-5
1.8.12 High Voltage ..................................................................................................... 1-5
1.8.13 Intrusive Solder ................................................................................................. 1-5
1.8.14 Kink ............................................................................................................. 1-5
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1.8.15 Locking Mechanism ............................................................................................. 1-5
1.8.16 Manufacturer .................................................................................................... 1-5
1.8.17 Meniscus (Component) ......................................................................................... 1-5
1.8.18 Noncommon Conductors ........................................................................................ 1-5
1.8.19 Nonfunctional Land ............................................................................................. 1-5
1.8.20 Pin-in-Paste ...................................................................................................... 1-5
1.8.21 Solder Balls ..................................................................................................... 1-5
1.8.22 Standard Industry Practice (SIP) ................................................................................ 1-5
1.8.23 Stress Relief ..................................................................................................... 1-6
1.8.24 Supplier .......................................................................................................... 1-6
1.8.25 Tempered Leads ................................................................................................. 1-6
1.8.26 User .............................................................................................................. 1-6
1.9 Requirements Flowdown ........................................................................................ 1-6
1.10 Personnel Proficiency ........................................................................................... 1-6
1.11 Acceptance Requirements ....................................................................................... 1-6
1.11.1 Missing Parts and Components ................................................................................. 1-6
1.11.2 Jumper Wire or Z-Wire .......................................................................................... 1-6
1.12 Minimum Electrical Clearance (MEC) ......................................................................... 1-7
1.13 Inspection Methodology ........................................................................................ 1-9
1.13.1 Lighting ......................................................................................................... 1-9
1.13.2 Magnification Aids .............................................................................................. 1-9
2.0 Applicable Documents ............................................................................................... 2-1
2.1 IPC Documents .................................................................................................. 2-1
2.2 Joint Industry Documents ....................................................................................... 2-2
2.3 Electrostatic Association Documents ........................................................................... 2-2
2.4 International Electrotechnical Commission Documents ........................................................ 2-2
2.5 ASTM ........................................................................................................... 2-2
2.6 Military Standards ............................................................................................... 2-3
2.7 SAE International ............................................................................................... 2-3
3.0 Handling Electronic Assemblies ..................................................................................... 3-1
4.0 Hardware ............................................................................................................ 4-1
4.1 Hardware Installation ........................................................................................... 4-2
4.1.1 Hardware Installation — Electrical Clearance .................................................................. 4-2
4.1.2 Hardware Installation — Interference ........................................................................... 4-3
4.1.3 Hardware Installation — Component Mounting – High Power ................................................ 4-4
4.1.4 Hardware Installation — Heatsinks ............................................................................. 4-6
4.1.4.1 Hardware Installation — Heatsinks – Insulators and Thermal Compounds .................................... 4-6
4.1.4.2 Hardware Installation — Heatsinks – Contact .................................................................. 4-7
4.1.5 Hardware Installation — Threaded Fasteners and Other Threaded Hardware .................................. 4-8
4.1.5.1 Hardware Installation — Threaded Fasteners and Other Threaded Hardware – Torque ......................4-10
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4.1.5.2 Hardware Installation — Threaded Fasteners and Other Threaded Hardware – Solid Wires .................4-12
4.1.5.3 Hardware Installation — Threaded Fasteners and Other Threaded Hardware – Stranded Wires..............4-14
4.2 Jackpost Mounting .............................................................................................4-15
4.3 Connector Pins .................................................................................................4-16
4.3.1 Connector Pins — Edge Connector Pins .......................................................................4-16
4.3.2 Connector Pins — Press Fit Pins ...............................................................................4-16
4.3.2.1 Connector Pins — Press Fit Pins – Land/Annular Ring .......................................................4-18
4.3.2.2 Connector Pins — Press Fit Pins – Soldering ..................................................................4-19
4.4 Wire Bundle Securing ..........................................................................................4-20
4.5 Routing — Wires and Wire Bundles ...........................................................................4-20
5.0 Soldering ............................................................................................................ 5-1
5.1 Soldering Acceptability Requirements .......................................................................... 5-2
5.2 Soldering Anomalies ............................................................................................ 5-3
5.2.1 Soldering Anomalies — Exposed Basis Metal .................................................................. 5-3
5.2.2 Soldering Anomalies — Pin Holes/Blow Holes/Voids .......................................................... 5-5
5.2.3 Soldering Anomalies — Reflow of Solder Paste ................................................................ 5-6
5.2.4 Soldering Anomalies — Nonwetting ............................................................................ 5-7
5.2.5 Soldering Anomalies — Cold Connection ...................................................................... 5-8
5.2.6 Soldering Anomalies — Dewetting ............................................................................. 5-8
5.2.7 Soldering Anomalies — Excess Solder ......................................................................... 5-9
5.2.7.1 Soldering Anomalies — Excess Solder – Solder Balls ........................................................5-10
5.2.7.2 Soldering Anomalies — Excess Solder – Bridging ............................................................5-11
5.2.7.3 Soldering Anomalies — Excess Solder – Solder Webbing/Splashes ..........................................5-12
5.2.8 Soldering Anomalies — Disturbed Solder .....................................................................5-13
5.2.9 Soldering Anomalies — Cooling Lines and Secondary Reflow ...............................................5-14
5.2.10 Soldering Anomalies — Fractured Solder .....................................................................5-15
5.2.11 Soldering Anomalies — Solder Projections....................................................................5-16
5.2.12 Soldering Anomalies — Pb-Free Fillet Lift ....................................................................5-17
5.2.13 Soldering Anomalies — Pb-Free Hot Tear/Shrink Hole .......................................................5-18
5.2.14 Probe Marks and Other Similar Surface Conditions in Solder Joints ..........................................5-19
5.2.15 Inclusions .......................................................................................................5-20
5.3 Partially Visible or Hidden Solder Connections ...............................................................5-20
5.4 Heat Shrinkable Soldering Devices ............................................................................5-21
6.0 Terminal Connections ................................................................................................ 6-1
6.1 Swaged Hardware ............................................................................................... 6-2
6.1.1 Swaged Hardware — Terminals ................................................................................ 6-2
6.1.1.1 Swaged Hardware — Terminals – Terminal Base to Land Separation ......................................... 6-2
6.1.1.2 Swaged Hardware — Terminals – Turret ....................................................................... 6-4
6.1.1.3 Swaged Hardware — Terminals – Bifurcated .................................................................. 6-5
6.1.2 Swaged Hardware — Rolled Flange ............................................................................ 6-6
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6.1.3 Swaged Hardware — Flared Flange ............................................................................ 6-7
6.1.4 Swaged Hardware — Controlled Split .......................................................................... 6-8
6.1.5 Swaged Hardware — Solder .................................................................................... 6-9
6.2 Insulation .......................................................................................................6-11
6.2.1 Insulation — Damage ..........................................................................................6-11
6.2.1.1 Insulation — Damage – Presolder .............................................................................6-11
6.2.1.2 Insulation — Damage – Post-Solder ...........................................................................6-13
6.2.2 Insulation — Clearance ........................................................................................6-14
6.2.3 Insulation — Insulation Sleeving ..............................................................................6-16
6.2.3.1 Insulation — Insulation Sleeving – Placement ................................................................6-16
6.2.3.2 Insulation — Insulation Sleeving – Damage ...................................................................6-18
6.3 Conductor ......................................................................................................6-19
6.3.1 Conductor — Deformation .....................................................................................6-19
6.3.2 Conductor — Damage .........................................................................................6-20
6.3.2.1 Conductor — Damage – Stranded Wire .......................................................................6-20
6.3.2.2 Conductor — Damage – Solid Wire ...........................................................................6-21
6.3.3 Conductor — Strand Separation (Birdcaging) – Presolder ....................................................6-21
6.3.4 Conductor — Strand Separation (Birdcaging) – Post-Solder ..................................................6-22
6.3.5 Conductor — Tinning ..........................................................................................6-23
6.4 Service Loops ..................................................................................................6-25
6.5 Routing — Wires and Wire Bundles – Bend Radius ...........................................................6-26
6.6 Stress Relief ....................................................................................................6-27
6.6.1 Stress Relief — Wire ...........................................................................................6-27
6.7 Lead/Conductor Placement — General Requirements .........................................................6-29
6.8 Solder — General Requirements ..............................................................................6-30
6.9 Turrets and Straight Pins .......................................................................................6-32
6.9.1 Turrets and Straight Pins — Conductor Placement ............................................................6-32
6.9.2 Turrets and Straight Pins — Solder ............................................................................6-34
6.10 Bifurcated ......................................................................................................6-35
6.10.1 Bifurcated — Conductor Placement – Side Route Attachments ...............................................6-35
6.10.2 Bifurcated — Conductor Placement – Staked Wires...........................................................6-37
6.10.3 Bifurcated — Conductor Placement – Bottom and Top Route Attachments ..................................6-38
6.10.4 Bifurcated — Solder ...........................................................................................6-39
6.11 Slotted ..........................................................................................................6-41
6.11.1 Slotted — Conductor Placement ...............................................................................6-41
6.11.2 Slotted — Solder ...............................................................................................6-42
6.12 Pierced/Perforated ..............................................................................................6-43
6.12.1 Pierced/Perforated — Conductor Placement ...................................................................6-43
6.12.2 Pierced/Perforated — Solder ...................................................................................6-45
6.13 Hook ............................................................................................................6-46
6.13.1 Hook — Conductor Placement .................................................................................6-46
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6.13.2 Hook — Solder .................................................................................................6-48
6.14 Solder Cups ....................................................................................................6-49
6.14.1 Solder Cups — Conductor Placement .........................................................................6-49
6.14.2 Solder Cups — Solder..........................................................................................6-50
6.15 AWG 30 and Smaller Diameter Wires — Conductor Placement ..............................................6-52
6.16 Series Connected ...............................................................................................6-54
6.17 Edge Clip — Position ..........................................................................................6-55
7.0 Through-Hole Technology ........................................................................................... 7-1
7.1 Component Mounting ........................................................................................... 7-1
7.1.1 Component Mounting — Orientation ........................................................................... 7-1
7.1.1.1 Component Mounting — Orientation – Horizontal ............................................................. 7-2
7.1.1.2 Component Mounting — Orientation – Vertical ................................................................ 7-3
7.1.2 Component Mounting — Lead Forming ........................................................................ 7-4
7.1.2.1 Component Mounting — Lead Forming – Bend Radius ....................................................... 7-4
7.1.2.2 Component Mounting — Lead Forming – Space between Seal/Weld and Bend ............................... 7-5
7.1.2.3 Component Mounting — Lead Forming – Stress Relief ........................................................ 7-6
7.1.2.4 Component Mounting — Lead Forming – Damage ............................................................ 7-8
7.1.3 Component Mounting — Leads Crossing Conductors ......................................................... 7-9
7.1.4 Component Mounting — Hole Obstruction....................................................................7-10
7.1.5 Component Mounting — DIP/SIP Devices and Sockets ......................................................7-11
7.1.6 Component Mounting — Radial Leads – Vertical .............................................................7-13
7.1.6.1 Component Mounting — Radial Leads – Vertical – Spacers ..................................................7-14
7.1.7 Component Mounting — Radial Leads – Horizontal ..........................................................7-15
7.1.8 Component Mounting — Connectors ..........................................................................7-16
7.1.8.1 Component Mounting — Connectors – Right Angle ..........................................................7-17
7.1.8.2 Component Mounting — Connectors – Vertical Shrouded Pin Headers and Vertical Receptacle
Connectors .....................................................................................................7-18
7.2 Component Securing ...........................................................................................7-19
7.2.1 Component Securing — Mounting Clips ......................................................................7-19
7.2.2 Component Securing — Adhesive Bonding ...................................................................7-20
7.2.2.1 Component Securing — Adhesive Bonding – Nonelevated Components .....................................7-21
7.2.2.2 Component Securing — Adhesive Bonding – Elevated Components .........................................7-24
7.2.3 Component Securing — Other Devices ........................................................................7-27
7.3 Supported Holes ................................................................................................7-28
7.3.1 Supported Holes — Axial Loaded – Horizontal ...............................................................7-28
7.3.2 Supported Holes — Axial Loaded – Vertical ..................................................................7-29
7.3.3 Supported Holes — Leads/Conductors Protrusion .............................................................7-31
7.3.4 Supported Holes — Lead/Conductor Clinches ................................................................7-32
7.3.5 Supported Holes — Solder .....................................................................................7-33
7.3.5.1 Supported Holes — Solder – Vertical Fill (A) .................................................................7-36
7.3.5.2 Supported Holes — Solder – Solder Destination Side – Lead to Barrel (B) ..................................7-38
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7.3.5.3 Supported Holes — Solder – Solder Destination Side – Land Area Coverage (C) ............................7-40
7.3.5.4 Supported Holes — Solder – Solder Source Side – Lead to Barrel (D) .......................................7-41
7.3.5.5 Supported Holes — Solder – Solder Source Side – Land Area Coverage (E) .................................7-42
7.3.5.6 Supported Holes — Solder Conditions – Solder in Lead Bend ................................................7-43
7.3.5.7 Supported Holes — Solder Conditions – Touching Through-Hole Component Body ........................7-44
7.3.5.8 Supported Holes — Solder Conditions – Meniscus in Solder .................................................7-45
7.3.5.9 Supported Holes — Lead Cutting After Soldering .............................................................7-47
7.3.5.10 Supported Holes — Coated Wire Insulation in Solder .........................................................7-48
7.3.5.11 Supported Holes — Interfacial Connection without Lead – Vias ..............................................7-49
7.3.5.12 Supported Holes — Board in Board ...........................................................................7-50
7.4 Unsupported Holes .............................................................................................7-53
7.4.1 Unsupported Holes — Axial Leads – Horizontal ..............................................................7-53
7.4.2 Unsupported Holes — Axial Leads – Vertical .................................................................7-54
7.4.3 Unsupported Holes — Wire/Lead Protrusion ..................................................................7-55
7.4.4 Unsupported Holes — Wire/Lead Clinches ....................................................................7-56
7.4.5 Unsupported Holes — Solder ..................................................................................7-58
7.4.6 Unsupported Holes — Lead Cutting After Soldering ..........................................................7-60
8.0 Surface Mount Assemblies .......................................................................................... 8-1
8.1 Staking Adhesive ................................................................................................ 8-2
8.1.1 Staking Adhesive — Component Bonding ...................................................................... 8-2
8.1.2 Staking Adhesive — Mechanical Strength ...................................................................... 8-3
8.2 SMT Leads ...................................................................................................... 8-5
8.2.1 SMT Leads — Plastic Components ............................................................................. 8-5
8.2.2 SMT Leads — Damage ......................................................................................... 8-5
8.2.3 SMT Leads — Flattening ....................................................................................... 8-6
8.3 SMT Connections ............................................................................................... 8-6
8.3.1 Chip Components — Bottom Only Terminations ............................................................... 8-7
8.3.1.1 Chip Components — Bottom Only Terminations – Side Overhang (A) ........................................ 8-8
8.3.1.2 Chip Components — Bottom Only Terminations – End Overhang (B) ........................................ 8-9
8.3.1.3 Chip Components — Bottom Only Terminations – End Joint Width (C) .....................................8-10
8.3.1.4 Chip Components — Bottom Only Terminations – Side Joint Length (D) ....................................8-11
8.3.1.5 Chip Components — Bottom Only Terminations – Maximum Fillet Height (E) ..............................8-12
8.3.1.6 Chip Components — Bottom Only Terminations – Minimum Fillet Height (F) ..............................8-12
8.3.1.7 Chip Components — Bottom Only Terminations – Solder Thickness (G) ....................................8-13
8.3.1.8 Chip Components — Bottom Only Terminations – End Overlap (J) ..........................................8-13
8.3.2 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) ...........................8-14
8.3.2.1 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Side Overhang (A) .............................................................................................8-15
8.3.2.2 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
End Overhang (B) ..............................................................................................8-17
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8.3.2.3 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
End Joint Width (C) ............................................................................................8-18
8.3.2.4 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Side Joint Length (D) ..........................................................................................8-20
8.3.2.5 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Maximum Fillet Height (E) ....................................................................................8-21
8.3.2.6 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Minimum Fillet Height (F) .....................................................................................8-22
8.3.2.7 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Solder Thickness (G) ...........................................................................................8-23
8.3.2.8 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
End Overlap (J) .................................................................................................8-24
8.3.2.9 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Termination Variations .........................................................................................8-25
8.3.2.9.1 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Termination Variations – Mounting on Side (Billboarding) ...................................................8-25
8.3.2.9.2 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Termination Variations – Mounting Upside Down .............................................................8-27
8.3.2.9.3 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Termination Variations – Stacking .............................................................................8-28
8.3.2.9.4 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Termination Variations – Tombstoning.........................................................................8-29
8.3.2.10 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Center and Lateral Terminations ...............................................................................8-30
8.3.2.10.1 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Center and Lateral Terminations – Solder Width of Side Termination ........................................8-31
8.3.2.10.2 Rectangular or Square End Chip Components — 1, 2, 3 or 5 Side Termination(s) –
Center and Lateral Terminations – Minimum Fillet Height of Side Termination ..............................8-32
8.3.3 Cylindrical End Cap Terminations .............................................................................8-33
8.3.3.1 Cylindrical End Cap Terminations — Side Overhang (A) .....................................................8-34
8.3.3.2 Cylindrical End Cap Terminations — End Overhang (B) .....................................................8-35
8.3.3.3 Cylindrical End Cap Terminations — End Joint Width (C) ...................................................8-36
8.3.3.4 Cylindrical End Cap Terminations — Side Joint Length (D) ..................................................8-37
8.3.3.5 Cylindrical End Cap Terminations — Maximum Fillet Height (E) ............................................8-38
8.3.3.6 Cylindrical End Cap Terminations — Minimum Fillet Height (F) ............................................8-39
8.3.3.7 Cylindrical End Cap Terminations — Solder Thickness (G) ..................................................8-40
8.3.3.8 Cylindrical End Cap Terminations — End Overlap (J) ........................................................8-41
8.3.3.9 Cylindrical End Cap Terminations — Center and Lateral Terminations .......................................8-42
8.3.4 Castellated Terminations .......................................................................................8-43
8.3.4.1 Castellated Terminations — Side Overhang (A) ...............................................................8-44
8.3.4.2 Castellated Terminations — End Overhang (B) ...............................................................8-45
8.3.4.3 Castellated Terminations — Minimum End Joint Width (C) ..................................................8-45
8.3.4.4 Castellated Terminations — Minimum Side Joint Length (D) .................................................8-46
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8.3.4.5 Castellated Terminations — Maximum Fillet Height (E) ......................................................8-46
8.3.4.6 Castellated Terminations — Minimum Fillet Height (F) ......................................................8-47
8.3.4.7 Castellated Terminations — Solder Thickness (G) ............................................................8-47
8.3.5 Flat Gull Wing Leads ...........................................................................................8-48
8.3.5.1 Flat Gull Wing Leads — Side Overhang (A) ..................................................................8-49
8.3.5.2 Flat Gull Wing Leads — Toe Overhang (B) ...................................................................8-52
8.3.5.3 Flat Gull Wing Leads — Minimum End Joint Width (C) ......................................................8-53
8.3.5.4 Flat Gull Wing Leads — Minimum Side Joint Length (D) ....................................................8-54
8.3.5.5 Flat Gull Wing Leads — Maximum Heel Fillet Height (E) ...................................................8-55
8.3.5.6 Flat Gull Wing Leads — Minimum Heel Fillet Height (F) ....................................................8-56
8.3.5.7 Flat Gull Wing Leads — Solder Thickness (G) ................................................................8-57
8.3.5.8 Flat Gull Wing Leads — Coplanarity ..........................................................................8-58
8.3.6 Round or Flattened (Coined) Gull Wing Leads ................................................................8-59
8.3.6.1 Round or Flattened (Coined) Gull Wing Leads — Side Overhang (A) ........................................8-60
8.3.6.2 Round or Flattened (Coined) Gull Wing Leads — Toe Overhang (B) .........................................8-61
8.3.6.3 Round or Flattened (Coined) Gull Wing Leads — Minimum End Joint Width (C) ...........................8-61
8.3.6.4 Round or Flattened (Coined) Gull Wing Leads — Minimum Side Joint Length (D) .........................8-62
8.3.6.5 Round or Flattened (Coined) Gull Wing Leads — Maximum Heel Fillet Height (E) .........................8-63
8.3.6.6 Round or Flattened (Coined) Gull Wing Leads — Minimum Heel Fillet Height (F) .........................8-64
8.3.6.7 Round or Flattened (Coined) Gull Wing Leads — Solder Thickness (G) .....................................8-65
8.3.6.8 Round or Flattened (Coined) Gull Wing Leads — Minimum Side Joint Height (Q) ..........................8-65
8.3.6.9 Round or Flattened (Coined) Gull Wing Leads — Coplanarity ...............................................8-66
8.3.7 J Leads..........................................................................................................8-67
8.3.7.1 J Leads — Side Overhang (A) .................................................................................8-67
8.3.7.2 J Leads — Toe Overhang (B) ..................................................................................8-69
8.3.7.3 J Leads — End Joint Width (C) ................................................................................8-70
8.3.7.4 J Leads — Side Joint Length (D) ..............................................................................8-71
8.3.7.5 J Leads — Maximum Heel Fillet Height (E) ..................................................................8-72
8.3.7.6 J Leads — Minimum Heel Fillet Height (F) ...................................................................8-73
8.3.7.7 J Leads — Solder Thickness (G) ...............................................................................8-75
8.3.7.8 J Leads — Coplanarity .........................................................................................8-75
8.3.8 Butt/I Connections .............................................................................................8-76
8.3.8.1 Butt/I Connections — Modified Through-Hole Terminations .................................................8-76
8.3.8.1.1 Butt/I Connections — Modified Through-Hole Terminations – Maximum Side Overhang (A) ..............8-77
8.3.8.1.2 Butt/I Connections — Modified Through-Hole Terminations – Toe Overhang (B) ...........................8-77
8.3.8.1.3 Butt/I Connections — Modified Through-Hole Terminations – Minimum End Joint Width (C)..............8-78
8.3.8.1.4 Butt/I Connections — Modified Through-Hole Terminations – Minimum Side Joint Length (D) ............8-78
8.3.8.1.5 Butt/I Connections — Modified Through-Hole Terminations – Maximum Fillet Height (E) .................8-78
8.3.8.1.6 Butt/I Connections — Modified Through-Hole Terminations – Minimum Fillet Height (F) ..................8-79
8.3.8.1.7 Butt/I Connections — Modified Through-Hole Terminations – Solder Thickness (G) ........................8-79
8.3.8.2 Butt/I Connections — Solder Charged Terminations ..........................................................8-80
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8.3.8.2.1 Butt/I Connections — Solder Charged Terminations – Maximum Side Overhang (A) .......................8-81
8.3.8.2.2 Butt/I Connections — Solder Charged Terminations – Maximum Toe Overhang (B) ........................8-81
8.3.8.2.3 Butt/I Connections — Solder Charged Terminations – Minimum End Joint Width (C) .......................8-82
8.3.8.2.4 Butt/I Connections — Solder Charged Terminations – Minimum Fillet Height (F) ...........................8-82
8.3.9 Flat Lug Leads .................................................................................................8-83
8.3.10 Tall Profile Components Having Bottom Only Terminations ..................................................8-84
8.3.11 Inward Formed L-Shaped Ribbon Leads ......................................................................8-85
8.3.12 Surface Mount Area Array .....................................................................................8-87
8.3.12.1 Surface Mount Area Array — Alignment ......................................................................8-88
8.3.12.2 Surface Mount Area Array — Solder Ball Spacing ............................................................8-88
8.3.12.3 Surface Mount Area Array — Solder Connections ............................................................8-89
8.3.12.4 Surface Mount Area Array — Voids ...........................................................................8-91
8.3.12.5 Surface Mount Area Array — Underfill/Staking ...............................................................8-91
8.3.12.6 Surface Mount Area Array — Package on Package ...........................................................8-92
8.3.13 Bottom Termination Components (BTC) ......................................................................8-94
8.3.14 Components with Bottom Thermal Pad Terminations (D-Pak) ................................................8-96
8.3.15 Flattened Post Connections ....................................................................................8-98
8.3.15.1 Flattened Post Connections — Maximum Termination Overhang – Square Solder Land .....................8-98
8.3.15.2 Flattened Post Connections — Maximum Termination Overhang – Round Solder Land .....................8-99
8.3.15.3 Flattened Post Connections — Maximum Fillet Height .......................................................8-99
8.3.16 P-Style Terminations ..........................................................................................8-100
8.3.16.1 P-Style Terminations — Maximum Side Overhang (A) ......................................................8-101
8.3.16.2 P-Style Terminations — Maximum Toe Overhang (B) .......................................................8-101
8.3.16.3 P-Style Terminations — Minimum End Joint Width (C) .....................................................8-102
8.3.16.4 P-Style Terminations — Minimum Side Joint Length (D) ....................................................8-102
8.3.16.5 P-Style Terminations — Minimum Fillet Height (F) .........................................................8-103
8.3.17 Vertical Cylindrical Cans with Outward L-Shaped Lead Terminations .......................................8-104
8.3.18 Flexible and Rigid Flex Printed Circuitry with Flat Uniformed Leads .......................................8-106
8.3.19 Wrapped Terminals ............................................................................................8-107
8.3.19.1 Wrapped Terminals — Side Overhang (A) ...................................................................8-108
8.3.19.2 Wrapped Terminals — End Joint Width (C) ..................................................................8-108
8.3.19.3 Wrapped Terminals — Side Joint Length (D).................................................................8-108
8.3.19.4 Wrapped Terminals — Minimum Heel Fillet Height (F) .....................................................8-109
8.3.19.5 Wrapped Terminals — Solder Thickness (G) .................................................................8-109
8.3.20 Flat Leaded Surface Mount Connectors .......................................................................8-110
8.4 Specialized SMT Terminations ................................................................................8-111
8.5 Surface Mount Connectors ....................................................................................8-112
8.5.1 Surface Mount Connectors — Surface Mount Threaded Standoffs (SMTS) or Surface Mount Fasteners ...8-113
9.0 Component Damage ................................................................................................. 9-1
9.1 Loss of Metallization ............................................................................................ 9-2
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9.2 Chip Resistor Element .......................................................................................... 9-3
9.3 Leaded/Leadless Devices ....................................................................................... 9-4
9.4 Ceramic Chip Capacitors ........................................................................................ 9-8
9.5 Connectors .....................................................................................................9-10
9.6 Relays ..........................................................................................................9-13
9.7 Ferrite Core Components ......................................................................................9-13
9.8 Connectors, Handles, Extractors, Latches .....................................................................9-14
9.9 Edge Connector Pins ...........................................................................................9-15
9.10 Press Fit Pins ...................................................................................................9-16
9.11 Backplane Connector Pins .....................................................................................9-17
9.12 Heatsink Hardware .............................................................................................9-18
9.13 Threaded Items and Hardware .................................................................................9-19
10.0 Printed Boards and Assemblies .....................................................................................10-1
10.1 Non-Soldered Contact Areas ...................................................................................10-1
10.1.1 Non-Soldered Contact Area — Contamination ................................................................10-1
10.1.2 Non-Soldered Contact Area — Damage .......................................................................10-3
10.2 Laminate Conditions ...........................................................................................10-3
10.2.1 Laminate Conditions — Measling and Crazing ................................................................10-5
10.2.2 Laminate Conditions — Blistering and Delamination .........................................................10-7
10.2.3 Laminate Conditions — Weave Texture/Weave Exposure ....................................................10-10
10.2.4 Laminate Conditions — Haloing ..............................................................................10-11
10.2.5 Laminate Conditions — Nicks and Cracks ...................................................................10-13
10.2.6 Laminate Conditions — Burns ................................................................................10-15
10.2.7 Laminate Conditions — Bow and Twist ......................................................................10-16
10.2.8 Laminate Conditions — Depanelization ......................................................................10-17
10.2.9 Laminate Conditions — Mechanical Damage ................................................................10-19
10.3 Conductors/Lands .............................................................................................10-20
10.3.1 Conductors/Lands — Reduction ..............................................................................10-20
10.3.2 Conductors/Lands — Lifted...................................................................................10-21
10.3.3 Conductors/Lands — Mechanical Damage ...................................................................10-23
10.4 Flexible and Rigid-Flex Printed Boards.......................................................................10-24
10.4.1 Flexible and Rigid-Flex Printed Boards — Damage ..........................................................10-24
10.4.2 Flexible and Rigid-Flex Printed Boards — Delamination/Blister ............................................10-27
10.4.2.1 Flexible and Rigid-Flex Printed Boards — Delamination/Blister – Flex .....................................10-27
10.4.2.2 Flexible and Rigid-Flex Printed Boards — Delamination/Blister – Flex to Stiffener ........................10-29
10.4.3 Flexible and Rigid-Flex Printed Boards — Solder Wicking ..................................................10-30
10.4.4 Flexible and Rigid-Flex Printed Boards — Attachment ......................................................10-31
10.5 Marking .......................................................................................................10-32
10.5.1 Marking — Etched (Including Hand Printing) ................................................................10-34
10.5.2 Marking — Screened ..........................................................................................10-35
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10.5.3 Marking — Stamped ..........................................................................................10-36
10.5.4 Marking — Laser .............................................................................................10-37
10.5.5 Marking — Labels ............................................................................................10-37
10.5.5.1 Marking — Labels – Bar Coding/Data Matrix ................................................................10-37
10.5.5.2 Marking — Labels – Readability .............................................................................10-38
10.5.5.3 Marking — Labels – Adhesion and Damage .................................................................10-39
10.5.5.4 Marking — Labels – Position .................................................................................10-39
10.5.6 Marking — Radio Frequency Identification (RFID) Tags ....................................................10-40
10.6 Cleanliness ....................................................................................................10-41
10.6.1 Cleanliness — Flux Residues .................................................................................10-42
10.6.1.1 Cleanliness — Flux Residues – Cleaning Required ..........................................................10-42
10.6.1.2 Cleanliness — Flux Residues – No Clean Process ...........................................................10-43
10.6.2 Cleanliness — Foreign Object Debris (FOD) .................................................................10-44
10.6.3 Cleanliness — Chlorides, Carbonates and White Residues ...................................................10-45
10.6.4 Cleanliness — Surface Appearance ...........................................................................10-47
10.7 Solder Mask Coating ..........................................................................................10-48
10.7.1 Solder Mask Coating — Wrinkling/Cracking .................................................................10-49
10.7.2 Solder Mask Coating — Voids, Blisters, Scratches ...........................................................10-51
10.7.3 Solder Mask Coating — Breakdown ..........................................................................10-53
10.7.4 Solder Mask Coating — Discoloration .......................................................................10-54
10.8 Conformal Coating ............................................................................................10-54
10.8.1 Conformal Coating — General ...............................................................................10-54
10.8.2 Conformal Coating — Coverage ..............................................................................10-55
10.8.3 Conformal Coating — Thickness .............................................................................10-57
10.9 Electrical Insulation Coating ..................................................................................10-58
10.9.1 Electrical Insulation Coating — Coverage ....................................................................10-58
10.9.2 Electrical Insulation Coating — Thickness ...................................................................10-58
10.10 Encapsulation .................................................................................................10-59
11.0 Discrete Wiring .....................................................................................................11-1
11.1 Solderless Wrap ................................................................................................11-1
12.0 High Voltage ........................................................................................................12-1
13.0 Jumper Wires .......................................................................................................13-1
13.1 Wire Routing ...................................................................................................13-2
13.2 Wire Staking — Adhesive or Tape .............................................................................13-3
13.3 Terminations ....................................................................................................13-4
13.3.1 Terminations — Lap ...........................................................................................13-5
13.3.1.1 Terminations — Lap – Component Lead ......................................................................13-5
13.3.1.2 Terminations — Lap – Land ...................................................................................13-7
13.3.2 Terminations — Wire in Hole ..................................................................................13-8
13.3.3 Terminations — Wrapped ......................................................................................13-9
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13.3.4 Terminations — SMT .........................................................................................13-10
13.3.4.1 Terminations — SMT – Chip and Cylindrical End Cap Components ........................................13-10
13.3.4.2 Terminations — SMT – Gull Wing ...........................................................................13-11
13.3.4.3 Terminations — SMT – Castellations .........................................................................13-13
Tables
Table 1-1 Summary of Related Documents ................................................................................ 1-1
Table 1-2 Inspection Magnification (Land Width) ......................................................................... 1-9
Table 1-3 Magnification Aid Applications For Wires And Soldered Conductors ........................................1-10
Table 1-4 Magnification Aid Applications – Other .......................................................................1-10
Table 6-1 Swaged Hardware Minimum Soldering Requirements ......................................................... 6-9
Table 6-2 Strand Damage .................................................................................................6-20
Table 6-3 Minimum Bend Radius Requirements .........................................................................6-26
Table 6-4 Turret or Straight Pin Terminal Conductor Placement .........................................................6-32
Table 6-5 Bifurcated Terminal Conductor Placement – Side Route ......................................................6-35
Table 6-6 Staking Requirements of Side Route Straight Through Connections – Bifurcated Terminals .................6-37
Table 6-7 Bifurcated Terminal Conductor Placement – Bottom Route ...................................................6-38
Table 6-8 Pierced or Perforated Terminal Conductor Placement .........................................................6-43
Table 6-9 Hook Terminal Conductor Placement ..........................................................................6-46
Table 6-10 AWG 30 and Smaller Wire Wrap Requirements ...............................................................6-52
Table 7-1 Lead Bend Radius ............................................................................................... 7-4
Table 7-2 Component to Land Clearance .................................................................................7-29
Table 7-3 Protrusion of Leads/Conductors in Supported Holes ..........................................................7-31
Table 7-4 Supported Hole – Minimum Solder Requirements ............................................................7-35
Table 7-5 Board in Board – Minimum Acceptable Solder Conditions ...................................................7-50
Table 7-6 Protrusion of Leads in Unsupported Holes ....................................................................7-55
Table 7-7 Unsupported Holes with Component Leads, Minimum Acceptable Conditions ..............................7-58
Table 8-1 Dimensional Criteria – Chip Component – Bottom Only Termination Features ............................... 8-7
Table 8-2 Dimensional Criteria – Rectangular or Square End Chip Components – 1, 2, 3 or 5 Side Termination(s) ....8-14
Table 8-2A Dimensional Criteria – Center/Lateral Termination (When Present) – Rectangular or Square End Chip
Components – 1, 2, 3 or 5 Side Termination(s) ................................................................8-30
Table 8-3 Dimensional Criteria – Cylindrical End Cap Termination .....................................................8-33
Table 8-3A Dimensional Criteria – Cylindrical End Cap Terminations – Center and Lateral Terminations ...............8-42
Table 8-4 Dimensional Criteria – Castellated Terminations ..............................................................8-43
Table 8-5 Dimensional Criteria – Flat Gull Wing Leads .................................................................8-48
Table 8-6 Dimensional Criteria – Round or Flattened (Coined) Gull Wing Lead Features ..............................8-59
Table 8-7 Dimensional Criteria – J Leads ................................................................................8-67
Table 8-8 Dimensional Criteria – Butt/I Connections – Modified Through-Hole Leads .................................8-76
Table 8-9 Dimensional Criteria – Butt/I Connections – Solder Charged Terminations ..................................8-80
Table 8-10 Dimensional Criteria – Flat Lug Leads ........................................................................8-83
Table 8-11 Dimensional Criteria – Tall Profile Components Having Bottom Only Terminations .........................8-84
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Table 8-12 Dimensional Criteria – Inward Formed L-Shaped Ribbon Leads .............................................8-85
Table 8-13 Dimensional Criteria – Ball Grid Array Components with Collapsing Balls ..................................8-87
Table 8-14 Ball Grid Array Components with Noncollapsing Balls .......................................................8-87
Table 8-15 Column Grid Array .............................................................................................8-87
Table 8-16 Dimensional Criteria – BTC ...................................................................................8-94
Table 8-17 Dimensional Criteria – Bottom Thermal Pad Terminations (D-Pak) ..........................................8-96
Table 8-18 Dimensional Criteria Flattened Post Connections .............................................................8-98
Table 8-19 Dimensional Criteria – P-Style Terminations .................................................................8-100
Table 8-20 Dimensional Criteria – Vertical Cylindrical Cans with Outward L-Shaped Lead Terminations .............8-105
Table 8-21 Dimensional Criteria – Flexible and Rigid-Flex Circuitry with Flat Unformed Leads .......................8-106
Table 8-22 Dimensional Criteria – Wrapped Terminals ...................................................................8-107
Table 8-23 Dimensional Criteria – Flat Leaded Surface Mount Connectors .............................................8-110
Table 8-24 SMTS/Surface Mount Fasteners – Minimum Acceptable Solder Conditions ................................8-113
Table 9-1 Nick or Chip-Out Criteria ....................................................................................... 9-8
Table 10-1 Coating Thickness Requirements .............................................................................10-57
Table A-1 Typical Static Charge Sources ..................................................................................A-3
Table A-2 Typical Static Voltage Generation ...............................................................................A-3
Table A-3 Recommended Practices for Handling Electronic Assemblies..................................................A-6
Appendix A Protecting the Assembly — ESD and Other Handling Considerations ..........................................A-1
A.1 ESD Prevention .................................................................................................A-1
A.1.1 ESD Control Program ...........................................................................................A-1
A.1.2 ESD Protective Area (EPA) Requirements ......................................................................A-2
A.1.3 Minimizing Static Charge .......................................................................................A-3
A.1.4 ESD Protective Packaging ......................................................................................A-4
A.1.5 Training..........................................................................................................A-4
A.1.6 Tools And Equipment ...........................................................................................A-4
A.1.7 Compliance Verification .........................................................................................A-5
A.1.8 ESD Prevention – Warning Labels ..............................................................................A-5
A.2 General Handling ................................................................................................A-6
A.2.1 Handling Considerations ........................................................................................A-6
A.2.2 Preventing Contamination.......................................................................................A-7
A.2.3 Handling Considerations – Gloves and Finger Cots ............................................................A-7
A.3 Moisture Sensitive Devices .....................................................................................A8
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